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PDF) Unusual Observations in the Wear-Out of High-Purity Aluminum
Cross-sectional SEM images of thermal-aged samples.
SEM image of (a) 60/40 brass, (b) the stir zone and base metal
Microstructural evolution of gold–aluminum wire-bonds
Microstructure variation in the ultrasonic bonding process between
Polymers, Free Full-Text
SEM images of the thinning and flip-chip integration of the sensor
Materials, Free Full-Text
Energies, Free Full-Text
PDF) Wire Bonding UPH and Stitch Bond Improvement using 20 Micron Diameter Insulated Wire with Security Bump
SEM of insulated wire bonds (study A). Dark stripes on deformed
SEM images of the Al/Au bond interface evolution aged at 200 ◦ C
Frontiers Microstructure and Mechanical Properties of Aluminum
Wirebonding - Semiconductor Engineering
Corrosion and tribocorrosion behaviors of ternary TiZrN coating on